Introducing AMD Helion, Agentic AI Compute at Rack Scale

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Community Support

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AMD is assisting form the next stage of AI facilities through open, versatile platforms, a broad portfolio of workload-optimized calculate and partnership throughout the community. AMD Helion brings that method to agentic AI, assisting partners match software application and calculate to the work representatives carry out and providing consumers versatility to scale as their requirements develop.

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  • “Agentic AI is altering what clients require from their facilities. It’s not almost calculate efficiency, however how the whole system is linked, handled and protected. Architectures like AMD Helion, integrated with Cisco’s full-stack facilities abilities, can offer consumers higher versatility to release, run and scale agentic work into their environments as their requirements develop.”– Jeremy Foster, Senior Vice President and General Manager, Cisco Compute
  • “Dell PowerRack offers clients option without compromise, and our assistance for AMD Helion Agentic Rack Reference Design extends that pledge to the next generation of agentic AI. By integrating AMD’s rack-scale architecture with Dell’s tested engineering competence, in addition to the versatility to extend implementations with Dell PowerRack for Networking and Storage, we’re offering consumers a total, confirmed course to release agentic calculate at scale with the manageability and dependability they get out of Dell.”– Arun Narayanan, Senior Vice President, Compute and Networking, Dell Technologies
  • “Hon Hai Technology Group continues to deepen its partnership with AMD on AI facilities, supporting the brand-new AMD Helion Agentic AI Rack recommendation style. Constructed on an open architecture, the platform integrates 6th Gen AMD EPYC processors with versatile CPU and GPU setups to resolve hyperscale information center and business Agentic AI work. The Group will continue to take advantage of its strengths in rack-level system combination and international production, dealing with community partners to advance rack-scale Agentic AI services and speed up next-generation AI facilities release.”– Hon Hai Technology Group
  • “Next-generation AI work need scale, effectiveness, and versatility that open, rack-scale architectures provide, as shown by our current client contract to release AMD Helios. For years, HPE and AMD have actually collectively promoted open requirements, and we are continuing to advance those efforts with AMD Helion. Together, we are introducing the next age of AI with open massive systems, boosted with air-cooled and direct liquid-cooled networking, supported by years of HPE knowledge and development.”– Trish Damkroger, Senior Vice President and General Manager, HPC & & AI Infrastructure Solutions, HPE
  • “As agentic AI moves into production, consumers require versatility in how and where they release it. That’s at the core of the Lenovo Hybrid AI Advantage, and AMD Helion will provide included flexibility to fulfill consumers where they are and support the work they wish to run.”– Scott Patti, VP, Infrastructure Solutions Group, Lenovo
  • “Agentic AI will need a series of system develops to serve various client requirements. AMD Helion supplies an open plan that provides QCT the versatility to customize calculate setups and bring system style and personalization knowledge to those requirements.”– Mike Yang, President of QCT
  • “Supermicro is speeding up the release of next-generation agentic AI facilities by bringing AMD’s Helion– the open, ORv3 certified rack-scale architecture to market through our Data Center Building Block Solutions ® (DCBBS). With our tested know-how in OCP accepted ™ rack-scale style, combination, liquid cooling, software application, and implementation services, we change sophisticated Agentic AI architectures into production-ready options. Together with AMD, we allow consumers to release quicker, scale effectively, and speed up time to online for agentic AI.”– Vik Malyala, Chief Business Officer, Supermicro
  • “AMD Helion offers an open, versatile structure for agentic AI facilities. Wiwynn is delighted to team up with AMD, bringing our proficiency in rack-level combination and advanced cooling to assist hyperscaler consumers customize systems that satisfy the requiring work, power requirements, and information center environments of the agentic AI age.”– William Lin, President and CEO, Wiwynn
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    Supporting Resources

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  • Discover more about AMD Helion
  • Find out more about AMD Instinct GPUs
  • Find out more about AMD EPYC CPUs
  • Follow AMD on LinkedIn
  • Follow AMD on X
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    About AMD
    AMD (NASDAQ: AMD) drives development in high-performance and AI computing to resolve the world’s crucial difficulties. Today, AMD innovation powers billions of experiences throughout cloud and AI facilities, ingrained systems, AI PCs and video gaming. With a broad portfolio of AI-optimized CPUs, GPUs, networking and software application, AMD provides full-stack AI options that supply the efficiency and scalability required for a brand-new age of smart computing. Discover more at www.amd.com

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    AMD, EPYC, Instinct and the AMD Arrow logo design and the mix thereof are hallmarks of Advanced Micro Devices, Inc. Other names are for informative functions just and might be hallmarks of their particular owners.

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    CAUTIONARY STATEMENT

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    This news release includes positive declarations worrying Advanced Micro Devices, Inc.( AMD)such as the functions, performance, efficiency, schedule, timing and anticipated advantages of AMD Helion, which are made pursuant to the Safe Harbor arrangements of the Private Securities Litigation Reform Act of 1995. Positive declarations are typically determined by words such as “would,” “might, “”anticipates, “”thinks, “”strategies, “”means, “”jobs”and other terms with comparable significance. Financiers are warned that the positive declarations in this news release are based upon existing beliefs, presumptions and expectations, speak just since the date of this news release and include threats and unpredictabilities that might trigger real outcomes to vary materially from existing expectations. Such declarations go through particular recognized and unidentified threats and unpredictabilities, a lot of which are hard to forecast and are normally beyond AMD’s control, that might trigger real outcomes and other future occasions to vary materially from those revealed in, or suggested or predicted by, the positive info and declarations. Product elements that might trigger real outcomes to vary materially from existing expectations consist of, without constraint, the following: effect of federal government actions and guidelines such as export guidelines, national-security-based policies, import tariffs, trade security procedures, and licensing requirements; competitive markets in which AMD’s items are offered; the cyclical nature of the semiconductor market; market conditions of the markets in which AMD items are offered; AMD’s capability to present items on a prompt basis with anticipated functions and efficiency levels; loss of a substantial consumer; financial and market unpredictability; quarterly and seasonal sales patterns; AMD’s capability to effectively secure its innovation or other copyright; undesirable currency exchange rate variations; capability of 3rd party producers to make AMD’s items on a prompt basis in adequate amounts and utilizing competitive innovations; schedule of vital devices, products, parts(such as memory supply), substrates or producing procedures; capability to attain anticipated production yields for AMD’s items; AMD’s capability to produce earnings from its semi-custom SoC items; prospective security vulnerabilities; possible security occurrences including IT interruptions, information loss, information breaches and cyberattacks; unpredictabilities including the purchasing and delivery of AMD’s items; AMD’s dependence on third-party copyright to style and present brand-new items; AMD’s dependence on third-party business for style, manufacture and supply of motherboards, software application, memory and other computer system platform elements; AMD’s dependence on Microsoft and other software application suppliers’assistance to style and establish software application to operate on AMD’s items; AMD’s dependence on third-party suppliers and add-in-board partners; effect of adjustment or disturbance of AMD’s internal service procedures and info systems; compatibility of AMD’s items with some or all industry-standard software application and hardware; expenses connected to malfunctioning items; failure to keep an effective supply chain as client need modifications; AMD’s capability to depend on 3rd party supply-chain logistics functions; AMD’s capability to successfully manage sales of its items on the gray market; effect of environment modification on AMD’s company; AMD’s capability to understand its deferred tax possessions; possible tax liabilities; existing and future claims and lawsuits; effect of ecological laws, dispute minerals associated arrangements and other laws or policies; developing expectations from federal governments, financiers, consumers and other stakeholders concerning business obligation matters; problems connected to the accountable usage of AI; limitations enforced by arrangements governing AMD’s notes, the assurances of Xilinx’s notes and the revolving credit arrangement; AMD’s capability to please monetary commitments under assurances, leases and other business dedications; effect of acquisitions, joint endeavors and/or financial investments on AMD’s organization and AMD’s capability to incorporate gotten companies; effect of any problems of the combined business’s properties; political, legal and financial dangers and natural catastrophes; future disabilities of innovation license purchases; AMD’s capability to draw in and keep crucial staff members; and AMD’s stock cost volatility. Financiers are prompted to examine in information the dangers and unpredictabilities in AMD’s Securities and Exchange Commission filings, consisting of however not restricted to AMD’s newest reports on Forms 10-K and 10-Q.

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    Contacts Aaron Grabein AMD Communications [email protected] Liz Stine AMD Investor Relations [email protected]

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